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Radius

Radius Mission

To be a leading source of equipment and services for the global market in Wireless Communication, Utility Automation and Remote Control.

Utility AutomationVoice CommunicationData Communication


Grand opening of Radius new surface mounting facility in Karlskrona
27 November 2008


”As a company, it will make us stronger to be able to offer a more complete chain, from circuit boards to a total system solution”, marketing communicator Åsa Alm explains. Radius strives to have a close collaboration between product designers, engineers and the manufacturing department. By bringing the manufacturing to Karlskrona, Radius will have a greater control of the entire chain, from circuit boards to a ready-made system solution. From now the surface mounting manufacturing, which before has been handled by subcontractors in Denmark and Sweden, will be produced in Karlskrona.

Modern machinery gives Radius better quality control
The surface mounting facility is a Fuji high-speed facility with the capacity to mount components down to a size of 02-01 consists of following machinery:

Screen-Printer Fuji GP-641E
The GP-641 is used to put solder paste on the printed circuit board. It utilizes sophisticated vision processing technology to apply the solder paste. The paste consists of small particles of tin, silver and copper mixed with flux.

Chip Placer Fuji CP-743E 
The Chip Placer is a machine that places the small components on the board. In 0.068 second it has placed one component, placing 15 components in a second or 56 000 components in an hour. The 6 ton machine can handle the markets smallest components –the 0201.

Flip Chip Placer Fuji QP-242E
The QP-placer handles the bigger components, as QFP’s and BGA’s. The placing accuracy of the flip-chip-mount is impressive with a tolerance of +/- 0.03 mm. Since the QP is fully equipped with 6 modules 6 cards can be handled simultaneously.

Reflow Oven Soltech Quantis Pro
When all the components are placed on the board it’s heated to approximately 250oC. The solder paste melts and the components are attached to the board. The oven has 8 heat zones and 2 cooling zones to have total control of the melting process.

3D X-Ray
By using x-ray-technology we ensure the quality of the process. By X-ray we can inspect all parts of the board, not only the parts you can inspect by eye.

Wave Solder Machine –Streckfuss
All through-hole mounted components are soldered with “non lead” alloys in the wave solder machine.

Get PDF describing the machinery.

Sub contractors and subsidiary companies were there
During the invitation people from Radius Karlskrona office were attending as well as staff from Niros. Niros is a company within Radius group from Farum outside of Copenhagen, responsible for voice communication products. Their circuit boards will also be produced in Karlskrona. Skanska, the company responsible for making Radius production facility twice as big, together with there subcontractors were also showing what they have done during the opening.


 
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